Light emitting package and light emitting package array
文献类型：专利
| 作者 | KIM, HYUNG-KUN; KIM, YU-SIK |
| 发表日期 | 2011-02-15 |
| 专利号 | US7888689 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light emitting package and light emitting package array |
| 英文摘要 | Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages. |
| 公开日期 | 2011-02-15 |
| 申请日期 | 2007-05-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37318]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, HYUNG-KUN,KIM, YU-SIK. Light emitting package and light emitting package array. US7888689. 2011-02-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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