Apparatus, system and method for use in mounting electronic elements
文献类型:专利
作者 | XIE, JIAN-HUI; LEUNG, CHI WING; WANG, XUAN |
发表日期 | 2017-07-18 |
专利号 | US9711703 |
著作权人 | CREE HUIZHOU OPTO LIMITED |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Apparatus, system and method for use in mounting electronic elements |
英文摘要 | The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation. |
公开日期 | 2017-07-18 |
申请日期 | 2008-02-12 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/37363] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | CREE HUIZHOU OPTO LIMITED |
推荐引用方式 GB/T 7714 | XIE, JIAN-HUI,LEUNG, CHI WING,WANG, XUAN. Apparatus, system and method for use in mounting electronic elements. US9711703. 2017-07-18. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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