Surface mount device
文献类型：专利
| 作者 | TANAKA, MINORU; WATANABE, SEISHI |
| 发表日期 | 2012-02-14 |
| 专利号 | US8115106 |
| 著作权人 | STANLEY ELECTRIC CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Surface mount device |
| 英文摘要 | The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component. Thus, the surface mount electronic device can improve reliability thereof while maintaining predetermined optical characteristics. |
| 公开日期 | 2012-02-14 |
| 申请日期 | 2008-11-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37397]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | STANLEY ELECTRIC CO., LTD. |
| 推荐引用方式 GB/T 7714 | TANAKA, MINORU,WATANABE, SEISHI. Surface mount device. US8115106. 2012-02-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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