Semiconductor light emitting device packages including submounts
文献类型：专利
| 作者 | LOH, BAN P.; MEDENDORP, JR., NICHOLAS; KELLER, BERND |
| 发表日期 | 2013-02-19 |
| 专利号 | US8378374 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor light emitting device packages including submounts |
| 英文摘要 | A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad. |
| 公开日期 | 2013-02-19 |
| 申请日期 | 2010-01-12 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37447]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | LOH, BAN P.,MEDENDORP, JR., NICHOLAS,KELLER, BERND. Semiconductor light emitting device packages including submounts. US8378374. 2013-02-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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