Optical semiconductor device encapsulated with silicone resin
文献类型：专利
| 作者 | KASHIWAGI, TSUTOMU; HONGO, TAKAHIRO |
| 发表日期 | 2012-04-24 |
| 专利号 | US8164202 |
| 著作权人 | SHIN-ETSU CHEMICAL CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical semiconductor device encapsulated with silicone resin |
| 英文摘要 | An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO3/2) units (wherein Φ represents a phenyl group) within the cured product, determined by solid 29Si-DD/MAS analysis, is within a range from 0.13 mol/100 g to 0.37 mol/100 g. |
| 公开日期 | 2012-04-24 |
| 申请日期 | 2010-02-23 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37451]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHIN-ETSU CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | KASHIWAGI, TSUTOMU,HONGO, TAKAHIRO. Optical semiconductor device encapsulated with silicone resin. US8164202. 2012-04-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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