Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
文献类型：专利
| 作者 | SEO, KI HO; KIM, TAE HOON; SHIN, SANG HYUN; HEO, CHEOL HO; LEE, YOUNG KI; PARK, JI HYUN |
| 发表日期 | 2013-02-05 |
| 专利号 | US8368291 |
| 著作权人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate |
| 英文摘要 | The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. |
| 公开日期 | 2013-02-05 |
| 申请日期 | 2010-12-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37486]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | SEO, KI HO,KIM, TAE HOON,SHIN, SANG HYUN,et al. Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate. US8368291. 2013-02-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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