Semiconductor device with a light emitting semiconductor die
文献类型：专利
| 作者 | LEE, KONG WENG; NG, KEE YEAN; KUAN, YEW CHEONG; TAN, CHENG WHY; TAN, GIN GHEE |
| 发表日期 | 2015-09-01 |
| 专利号 | US9123869 |
| 著作权人 | DOCUMENT SECURITY SYSTEMS, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device with a light emitting semiconductor die |
| 英文摘要 | A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements. |
| 公开日期 | 2015-09-01 |
| 申请日期 | 2011-02-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37501]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DOCUMENT SECURITY SYSTEMS, INC. |
| 推荐引用方式 GB/T 7714 | LEE, KONG WENG,NG, KEE YEAN,KUAN, YEW CHEONG,et al. Semiconductor device with a light emitting semiconductor die. US9123869. 2015-09-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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