Semiconductor light emitting device packages and methods
文献类型：专利
| 作者 | LOH, BAN P.; CANNON, NATHANIEL O.; HILLER, NORBERT; EDMOND, JOHN; JACKSON, MITCH; MEDENDORP, JR., NICHOLAS W. |
| 发表日期 | 2014-07-29 |
| 专利号 | US8791491 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor light emitting device packages and methods |
| 英文摘要 | A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed. |
| 公开日期 | 2014-07-29 |
| 申请日期 | 2011-06-20 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37521]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | LOH, BAN P.,CANNON, NATHANIEL O.,HILLER, NORBERT,et al. Semiconductor light emitting device packages and methods. US8791491. 2014-07-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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