Semiconductor device and heat sink with 3-dimensional thermal conductivity
文献类型：专利
| 作者 | KURODA, NAOTAKA; WAKEJIMA, AKIO; TANOMURA, MASAHIRO; MIYAMOTO, HIRONOBU |
| 发表日期 | 2013-07-02 |
| 专利号 | US8476756 |
| 著作权人 | NEC CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device and heat sink with 3-dimensional thermal conductivity |
| 英文摘要 | A semiconductor device includes a semiconductor element having a rectangular two-dimensional geometry and serving as a heat source, a first heat sink section including the semiconductor element mounted thereon, and a second heat sink section joined to an opposite side of the first heat sink section that includes the semiconductor element. A relation among directional components of thermal conductivity is K1yy≧K1xx>K1zz, where directional components of a three-dimensional thermal conductivity of the heat sink section in X, Y, and Z directions are determined as Kxx, Kyy, and Kzz. A relation among directional components of a thermal conductivity of the second heat sink section is K2zz≧K2yy>K2xx or K2yy≧K2zz>K2xx, where the directional components of the thermal conductivity of the second heat sink section in X, Y, and X directions are determined as K2xx, K2yy, and K2zz. |
| 公开日期 | 2013-07-02 |
| 申请日期 | 2011-09-21 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37547]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORPORATION |
| 推荐引用方式 GB/T 7714 | KURODA, NAOTAKA,WAKEJIMA, AKIO,TANOMURA, MASAHIRO,et al. Semiconductor device and heat sink with 3-dimensional thermal conductivity. US8476756. 2013-07-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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