Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging
文献类型：专利
| 作者 | LOH, BAN P.; MEDENDORP, JR., NICHOLAS W.; TARSA, ERIC; KELLER, BERND |
| 发表日期 | 2015-01-27 |
| 专利号 | US8941134 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging |
| 英文摘要 | A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed. |
| 公开日期 | 2015-01-27 |
| 申请日期 | 2011-09-23 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37549]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | LOH, BAN P.,MEDENDORP, JR., NICHOLAS W.,TARSA, ERIC,et al. Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging. US8941134. 2015-01-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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