Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device
文献类型：专利
| 作者 | KIM, YU-SIK; PARK, SANG-JOON |
| 发表日期 | 2012-12-25 |
| 专利号 | US8338204 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device |
| 英文摘要 | The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer. |
| 公开日期 | 2012-12-25 |
| 申请日期 | 2011-10-24 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37555]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, YU-SIK,PARK, SANG-JOON. Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device. US8338204. 2012-12-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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