Light-emitting device package and method of manufacturing the same
文献类型：专利
| 作者 | YOO, CHEOL-JUN; SONG, YOUNG-HEE; HWANG, SEONG-DEOK; LEE, SANG-HYUN |
| 发表日期 | 2015-03-24 |
| 专利号 | US8987022 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light-emitting device package and method of manufacturing the same |
| 英文摘要 | Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device. |
| 公开日期 | 2015-03-24 |
| 申请日期 | 2012-01-05 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37564]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | YOO, CHEOL-JUN,SONG, YOUNG-HEE,HWANG, SEONG-DEOK,et al. Light-emitting device package and method of manufacturing the same. US8987022. 2015-03-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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