Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips
文献类型:专利
作者 | ENGL, KARL; MAUTE, MARKUS; RAMMELSBERGER, STEFANIE; KASPRZAK-ZABLOCKA, ANNA |
发表日期 | 2016-05-17 |
专利号 | US9343637 |
著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips |
英文摘要 | An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer is disposed on the side of the active region facing the substrate. The first semiconductor layer is electrically conductively connected to a first termination layer that is disposed between the substrate and the semiconductor body. An encapsulation layer is disposed between the first termination layer and the substrate and, in plan view of the semiconductor chip, projects at least in some regions over a side face which delimits the semiconductor body. |
公开日期 | 2016-05-17 |
申请日期 | 2012-02-07 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/37571] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
推荐引用方式 GB/T 7714 | ENGL, KARL,MAUTE, MARKUS,RAMMELSBERGER, STEFANIE,et al. Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips. US9343637. 2016-05-17. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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