Glass system for hermetically joining Cu components, and housing for electronic components
文献类型：专利
| 作者 | HETTLER, ROBERT; RINDT, MATTHIAS |
| 发表日期 | 2017-10-31 |
| 专利号 | US9807897 |
| 著作权人 | SCHOTT AG |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Glass system for hermetically joining Cu components, and housing for electronic components |
| 英文摘要 | An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass. |
| 公开日期 | 2017-10-31 |
| 申请日期 | 2012-03-05 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37575]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SCHOTT AG |
| 推荐引用方式 GB/T 7714 | HETTLER, ROBERT,RINDT, MATTHIAS. Glass system for hermetically joining Cu components, and housing for electronic components. US9807897. 2017-10-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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