Semiconductor device and method for manufacturing the same
文献类型：专利
| 作者 | AOKI, TOMOYUKI; TSURUME, TAKUYA; ADACHI, HIROKI; HORIKOSHI, NOZOMI; OHTANI, HISASHI |
| 发表日期 | 2016-11-29 |
| 专利号 | US9508619 |
| 著作权人 | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device and method for manufacturing the same |
| 英文摘要 | A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip. |
| 公开日期 | 2016-11-29 |
| 申请日期 | 2013-06-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37679]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 推荐引用方式 GB/T 7714 | AOKI, TOMOYUKI,TSURUME, TAKUYA,ADACHI, HIROKI,et al. Semiconductor device and method for manufacturing the same. US9508619. 2016-11-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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