Submount, encapsulated semiconductor element, and methods of manufacturing the same
文献类型：专利
| 作者 | SONG, XUELIANG; SATO, NOZOMU; KANNO, GENTA; MAKINO, YOHKO |
| 发表日期 | 2016-02-16 |
| 专利号 | US9263411 |
| 著作权人 | ADVANCED PHOTONICS, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Submount, encapsulated semiconductor element, and methods of manufacturing the same |
| 英文摘要 | The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps, are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount. |
| 公开日期 | 2016-02-16 |
| 申请日期 | 2013-07-05 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37684]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED PHOTONICS, INC. |
| 推荐引用方式 GB/T 7714 | SONG, XUELIANG,SATO, NOZOMU,KANNO, GENTA,et al. Submount, encapsulated semiconductor element, and methods of manufacturing the same. US9263411. 2016-02-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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