Encapsulating sheet-covered semiconductor element and semiconductor device
文献类型：专利
| 作者 | KATAYAMA, HIROYUKI; KONDO, TAKASHI; EBE, YUKI; MITANI, MUNEHISA |
| 发表日期 | 2015-05-05 |
| 专利号 | US9024353 |
| 著作权人 | EPISTAR CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Encapsulating sheet-covered semiconductor element and semiconductor device |
| 英文摘要 | An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element. |
| 公开日期 | 2015-05-05 |
| 申请日期 | 2013-10-01 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37697]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | EPISTAR CORPORATION |
| 推荐引用方式 GB/T 7714 | KATAYAMA, HIROYUKI,KONDO, TAKASHI,EBE, YUKI,et al. Encapsulating sheet-covered semiconductor element and semiconductor device. US9024353. 2015-05-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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