Flexible packaging for microelectronic devices
文献类型：专利
| 作者 | ANDERSON, BENJAMIN JOHN; NIELSON, GREGORY N.; CRUZ-CAMPA, JOSE LUIS; OKANDAN, MURAT; LENTINE, ANTHONY L.; RESNICK, PAUL J. |
| 发表日期 | 2018-05-22 |
| 专利号 | US9978895 |
| 著作权人 | NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Flexible packaging for microelectronic devices |
| 英文摘要 | An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. |
| 公开日期 | 2018-05-22 |
| 申请日期 | 2013-10-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37700]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC |
| 推荐引用方式 GB/T 7714 | ANDERSON, BENJAMIN JOHN,NIELSON, GREGORY N.,CRUZ-CAMPA, JOSE LUIS,et al. Flexible packaging for microelectronic devices. US9978895. 2018-05-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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