Optoelectronic package
文献类型：专利
| 作者 | WONG, WILL KIANG; PARSA, ROOZBEH; FRENCH, WILLIAM; NAKANISHI, NOBORU |
| 发表日期 | 2018-02-20 |
| 专利号 | US9899794 |
| 著作权人 | TEXAS INSTRUMENTS INCORPORATED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optoelectronic package |
| 英文摘要 | A optoelectronic package includes an inner package with a dielectric substrate having at least a first dielectric level with a photodetector (PD) die on a die attach area, first routing connecting a first contact to a first external bond pad (FEBP), and second routing connecting a second contact to a second external bond pad (SEBP). An outer package (OP) includes a ceramic substrate including a light source die on a base portion in direct line of sight with the PD including a first electrode and second electrode. A first wire bond connects the FEBP to a first terminal, a second wire bond connects the SEBP to a second terminal, a third wire bond connects the first electrode to a third terminal, and a fourth wire bond connects the second electrode to a fourth terminal. |
| 公开日期 | 2018-02-20 |
| 申请日期 | 2014-06-30 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37760]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TEXAS INSTRUMENTS INCORPORATED |
| 推荐引用方式 GB/T 7714 | WONG, WILL KIANG,PARSA, ROOZBEH,FRENCH, WILLIAM,et al. Optoelectronic package. US9899794. 2018-02-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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