Encapsulation material for light emitting diodes
文献类型：专利
| 作者 | GROTTENMULLER, RALPH; KARUNANANDAN, ROSALIN; KITA, FUMIO; LENZ, HELMUT; WAGNER, DIETER |
| 发表日期 | 2018-06-05 |
| 专利号 | US9991182 |
| 著作权人 | AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Encapsulation material for light emitting diodes |
| 英文摘要 | The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance. |
| 公开日期 | 2018-06-05 |
| 申请日期 | 2014-07-16 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37765]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L. |
| 推荐引用方式 GB/T 7714 | GROTTENMULLER, RALPH,KARUNANANDAN, ROSALIN,KITA, FUMIO,et al. Encapsulation material for light emitting diodes. US9991182. 2018-06-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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