Laser diode with cooling along even the side surfaces
文献类型:专利
作者 | HORN, MARKUS; STOJETZ, BERNHARD |
发表日期 | 2017-01-31 |
专利号 | US9559491 |
著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Laser diode with cooling along even the side surfaces |
英文摘要 | A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink. |
公开日期 | 2017-01-31 |
申请日期 | 2014-08-14 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/37768] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
推荐引用方式 GB/T 7714 | HORN, MARKUS,STOJETZ, BERNHARD. Laser diode with cooling along even the side surfaces. US9559491. 2017-01-31. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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