Thermally conductive silicone composition and electrical/electronic apparatus
文献类型：专利
| 作者 | KATO, TOMOKO; KODAMA, HARUMI; ONISHI, MASAYUKI |
| 发表日期 | 2018-12-11 |
| 专利号 | US10150902 |
| 著作权人 | DOW CORNING TORAY CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Thermally conductive silicone composition and electrical/electronic apparatus |
| 英文摘要 | Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler. |
| 公开日期 | 2018-12-11 |
| 申请日期 | 2015-03-26 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37813]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DOW CORNING TORAY CO., LTD. |
| 推荐引用方式 GB/T 7714 | KATO, TOMOKO,KODAMA, HARUMI,ONISHI, MASAYUKI. Thermally conductive silicone composition and electrical/electronic apparatus. US10150902. 2018-12-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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