Package structures and methods of forming the same
文献类型：专利
| 作者 | HOU, HAO-CHENG; LIU, MING-CHE; CHUANG, CHUN-CHIH; CHENG, JUNG WEI; WANG, TSUNG-DING; LIN, HUNG-JEN |
| 发表日期 | 2017-02-07 |
| 专利号 | US9564416 |
| 著作权人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package structures and methods of forming the same |
| 英文摘要 | Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant. |
| 公开日期 | 2017-02-07 |
| 申请日期 | 2015-04-24 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37816]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 推荐引用方式 GB/T 7714 | HOU, HAO-CHENG,LIU, MING-CHE,CHUANG, CHUN-CHIH,et al. Package structures and methods of forming the same. US9564416. 2017-02-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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