Optoelectronic packages having through-channels for routing and vacuum
文献类型：专利
| 作者 | PARSA, ROOZBEH; FRENCH, WILLIAM |
| 发表日期 | 2017-01-10 |
| 专利号 | US9543735 |
| 著作权人 | TEXAS INSTRUMENTS INCORPORATED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optoelectronic packages having through-channels for routing and vacuum |
| 英文摘要 | A stacked optoelectronic packaged device includes a plurality of stacked components within a package material having a package body providing side walls and a bottom wall for the package, and a lid which seals a top of the package. The stacked components include a first cavity die having a top surface and a bottom surface including at least one through-channel formed in the bottom surface. A bottom die has a top surface including at least one electrical trace and a light source die thereon. At least one of the through-channels of the first cavity die are aligned to the electrical trace, and the first cavity die is bonded to the bottom die with the electrical trace being within the through-channel and not contacting the first cavity die to provide a vacuum sealing structure. A photodetector (PD) is optically coupled to receive the light originating from the light source. |
| 公开日期 | 2017-01-10 |
| 申请日期 | 2015-04-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37817]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TEXAS INSTRUMENTS INCORPORATED |
| 推荐引用方式 GB/T 7714 | PARSA, ROOZBEH,FRENCH, WILLIAM. Optoelectronic packages having through-channels for routing and vacuum. US9543735. 2017-01-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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