Thermo-electric cooling system and method for cooling electronic devices
文献类型：专利
| 作者 | CONNOLLY, JOHN; ROULSTON, JOHN F.; MANDELIK, DANIEL |
| 发表日期 | 2017-10-31 |
| 专利号 | US9806491 |
| 著作权人 | NOVATRANS GROUP SA |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Thermo-electric cooling system and method for cooling electronic devices |
| 英文摘要 | A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface. |
| 公开日期 | 2017-10-31 |
| 申请日期 | 2015-08-12 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37832]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NOVATRANS GROUP SA |
| 推荐引用方式 GB/T 7714 | CONNOLLY, JOHN,ROULSTON, JOHN F.,MANDELIK, DANIEL. Thermo-electric cooling system and method for cooling electronic devices. US9806491. 2017-10-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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