Flexible electronic circuits with embedded integrated circuit die
文献类型：专利
| 作者 | DALAL, MITUL; GUPTA, SANJAY |
| 发表日期 | 2018-02-20 |
| 专利号 | US9899330 |
| 著作权人 | MC10, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Flexible electronic circuits with embedded integrated circuit die |
| 英文摘要 | Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer. |
| 公开日期 | 2018-02-20 |
| 申请日期 | 2015-09-30 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37843]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MC10, INC. |
| 推荐引用方式 GB/T 7714 | DALAL, MITUL,GUPTA, SANJAY. Flexible electronic circuits with embedded integrated circuit die. US9899330. 2018-02-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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