Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same
文献类型：专利
| 作者 | ICHIKAWA, MASATSUGU; SHICHIJO, SATOSHI; SHIMATSU, TAKEHITO |
| 发表日期 | 2018-06-05 |
| 专利号 | US9991434 |
| 著作权人 | NICHIA CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same |
| 英文摘要 | A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member. |
| 公开日期 | 2018-06-05 |
| 申请日期 | 2015-12-21 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37858]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NICHIA CORPORATION |
| 推荐引用方式 GB/T 7714 | ICHIKAWA, MASATSUGU,SHICHIJO, SATOSHI,SHIMATSU, TAKEHITO. Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same. US9991434. 2018-06-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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