Photonic integrated circuit using chip integration
文献类型：专利
| 作者 | CHANG, CHIA-MING; DE VALICOURT, GUILHEM |
| 发表日期 | 2017-09-12 |
| 专利号 | US9762334 |
| 著作权人 | ALCATEL-LUCENT USA INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Photonic integrated circuit using chip integration |
| 英文摘要 | We disclose a photonic integrated circuit (PIC) having a first photonic chip and a second photonic chip that are bonded and optically coupled to one another in a manner that reduces the number of different photonic chips that need to be integrated into the same PIC package to achieve a desired electro-optical function. In an example embodiment, the first photonic chip may include active optical components, such as lasers and optical amplifiers, and be fabricated using the III-V semiconductor technology. The second photonic chip may include additional optical components, such as modulators, photodetectors, and passive optical components, and be fabricated using the CMOS technology. The second photonic chip may also include one or more 2×2 optical couplers configured to appropriately (re)direct various optical signals between the active optical components of the first photonic chip and the additional optical components of the second photonic chip to achieve the desired electro-optical function. |
| 公开日期 | 2017-09-12 |
| 申请日期 | 2015-12-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37859]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ALCATEL-LUCENT USA INC. |
| 推荐引用方式 GB/T 7714 | CHANG, CHIA-MING,DE VALICOURT, GUILHEM. Photonic integrated circuit using chip integration. US9762334. 2017-09-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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