中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Semiconductor apparatus and method of manufacturing the same

文献类型:专利

作者ZHANG, LEI; LI, QIMING; XU, HUIWEN; OU, FANG; CHONG, WING CHEUNG
发表日期2019-01-08
专利号US10177127
著作权人HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
国家美国
文献子类授权发明
其他题名Semiconductor apparatus and method of manufacturing the same
英文摘要A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.
公开日期2019-01-08
申请日期2016-01-27
状态授权
源URL[http://ir.opt.ac.cn/handle/181661/37866]  
专题半导体激光器专利数据库
作者单位HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
推荐引用方式
GB/T 7714
ZHANG, LEI,LI, QIMING,XU, HUIWEN,et al. Semiconductor apparatus and method of manufacturing the same. US10177127. 2019-01-08.

入库方式: OAI收割

来源:西安光学精密机械研究所

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