Hybrid integrated MCM with waveguide-fiber connector
文献类型:专利
作者 | SHUBIN, IVAN; ZHENG, XUEZHE; LEE, JIN-HYOUNG; KRISHNAMOORTHY, ASHOK V. |
发表日期 | 2017-07-04 |
专利号 | US9698564 |
著作权人 | ORACLE INTERNATIONAL CORPORATION |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Hybrid integrated MCM with waveguide-fiber connector |
英文摘要 | A multi-chip module (MCM) includes: an interposer, a photonic chip, an optical gain chip, and a waveguide-fiber connector. The photonic chip, which may be electrically coupled to the interposer, may be implemented using a silicon-on-insulator (SOI) technology, and may include an optical waveguide that conveys an optical signal. Moreover, the optical gain chip, which may be electrically coupled to the interposer, may include a III-V compound semiconductor, and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Furthermore, the waveguide-fiber connector may be mechanically coupled to the interposer, and remateably mechanically coupled to an optical fiber coupler that includes the optical fiber. The waveguide-fiber connector may convey the optical signal between the optical waveguide in the photonic chip and the optical fiber. |
公开日期 | 2017-07-04 |
申请日期 | 2016-02-09 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/37871] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | ORACLE INTERNATIONAL CORPORATION |
推荐引用方式 GB/T 7714 | SHUBIN, IVAN,ZHENG, XUEZHE,LEE, JIN-HYOUNG,et al. Hybrid integrated MCM with waveguide-fiber connector. US9698564. 2017-07-04. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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