Mold release film and process for producing semiconductor package
文献类型：专利
| 作者 | KASAI, WATARU; SUZUKI, MASAMI |
| 发表日期 | 2018-01-02 |
| 专利号 | US9859133 |
| 著作权人 | AGC INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Mold release film and process for producing semiconductor package |
| 英文摘要 | A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided. |
| 公开日期 | 2018-01-02 |
| 申请日期 | 2016-03-04 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37876]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AGC INC. |
| 推荐引用方式 GB/T 7714 | KASAI, WATARU,SUZUKI, MASAMI. Mold release film and process for producing semiconductor package. US9859133. 2018-01-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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