Light emitting device package and lighting apparatus
文献类型：专利
| 作者 | SEO, JAE WON; KIM, HOE JUN; YIM, BUM JIN; HONG, JUN HEE |
| 发表日期 | 2019-08-13 |
| 专利号 | US10381519 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light emitting device package and lighting apparatus |
| 英文摘要 | A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole. |
| 公开日期 | 2019-08-13 |
| 申请日期 | 2016-03-16 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37878]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | SEO, JAE WON,KIM, HOE JUN,YIM, BUM JIN,et al. Light emitting device package and lighting apparatus. US10381519. 2019-08-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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