Photonic transceiving device package structure
文献类型：专利
| 作者 | NAGARAJAN, RADHAKRISHNAN L.; LI, PENG-CHIH; KATO, MASAKI; TOGAMI, CHRIS |
| 发表日期 | 2017-06-06 |
| 专利号 | US9671580 |
| 著作权人 | INPHI CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Photonic transceiving device package structure |
| 英文摘要 | An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module. |
| 公开日期 | 2017-06-06 |
| 申请日期 | 2016-03-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37880]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INPHI CORPORATION |
| 推荐引用方式 GB/T 7714 | NAGARAJAN, RADHAKRISHNAN L.,LI, PENG-CHIH,KATO, MASAKI,et al. Photonic transceiving device package structure. US9671580. 2017-06-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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