Optical wire bond apparatus and methods employing laser-written waveguides
文献类型：专利
| 作者 | SUTHERLAND, JAMES SCOTT |
| 发表日期 | 2018-12-25 |
| 专利号 | US10162112 |
| 著作权人 | CORNING OPTICAL COMMUNICATIONS LLC |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical wire bond apparatus and methods employing laser-written waveguides |
| 英文摘要 | An optical wire bond apparatus for optically connecting an optical-electrical integrated circuit (OE-IC) to an optical-electrical printed circuit board (OE-PCB) is formed by laser writing cores in a flexible glass support member to define an array of optical waveguides. The support member has a bend section and the waveguides reside close to either a top or bottom surface of the support member at the bend section. The cores have a front-end portion that can be laser written after the front end of the support member is coarse-aligned to optical waveguide structures in the OE-PCB to obtain fine alignment. The support members can be formed from flexible glass sheets or by drawing a glass preform. A photonic assembly that includes the OE-IC and the OE-PCB optically connected using the optical wire bond apparatus is also disclosed. |
| 公开日期 | 2018-12-25 |
| 申请日期 | 2016-05-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37893]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CORNING OPTICAL COMMUNICATIONS LLC |
| 推荐引用方式 GB/T 7714 | SUTHERLAND, JAMES SCOTT. Optical wire bond apparatus and methods employing laser-written waveguides. US10162112. 2018-12-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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