Self-assembled vertically aligned multi-chip module
文献类型：专利
| 作者 | SHUBIN, IVAN; ZHENG, XUEZHE; LEE, JIN HYOUNG; RAJ, KANNAN; KRISHNAMOORTHY, ASHOK V. |
| 发表日期 | 2016-12-13 |
| 专利号 | US9519105 |
| 著作权人 | ORACLE INTERNATIONAL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Self-assembled vertically aligned multi-chip module |
| 英文摘要 | A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip. |
| 公开日期 | 2016-12-13 |
| 申请日期 | 2016-06-21 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37899]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ORACLE INTERNATIONAL CORPORATION |
| 推荐引用方式 GB/T 7714 | SHUBIN, IVAN,ZHENG, XUEZHE,LEE, JIN HYOUNG,et al. Self-assembled vertically aligned multi-chip module. US9519105. 2016-12-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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