Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides
文献类型：专利
| 作者 | GAMBINO, JEFFREY P.; LEIDY, ROBERT K.; ELLIS-MONAGHAN, JOHN J.; CUCCI, BRETT T.; MALING, JEFFREY C.; ROSENBERG, JESSIE C. |
| 发表日期 | 2017-07-25 |
| 专利号 | US9715064 |
| 著作权人 | GLOBALFOUNDRIES INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides |
| 英文摘要 | Disclosed are multi-chip modules (MCMs) that allow for chip-to-chip transmission of light signals. The MCMs can incorporate at least two components, which are attached (e.g., by interconnects). For example, in one MCM disclosed herein, the two components can be an integrated circuit chip and an interposer to which the integrated circuit chip and one or more additional integrated circuit chips are attached by interconnects. In another MCM disclosed herein, the two components can be two integrated circuit chips that are stacked and attached to each other by interconnects. In either case, the two components can each have a waveguide and a grating coupler coupled to one end of the waveguide. The grating couplers on the different components can be approximately vertically aligned, thereby allowing light signals to be transmitted between the waveguides on those different components. Also, disclosed herein are methods of forming such MCMs. |
| 公开日期 | 2017-07-25 |
| 申请日期 | 2016-09-13 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37910]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GLOBALFOUNDRIES INC. |
| 推荐引用方式 GB/T 7714 | GAMBINO, JEFFREY P.,LEIDY, ROBERT K.,ELLIS-MONAGHAN, JOHN J.,et al. Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides. US9715064. 2017-07-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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