Semiconductor laser module and three-dimensional laminating and shaping apparatus
文献类型：专利
| 作者 | ISHIGE, YUTA; KATAYAMA, ETSUJI; MORI, HAJIME |
| 发表日期 | 2019-03-19 |
| 专利号 | US10234645 |
| 著作权人 | TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser module and three-dimensional laminating and shaping apparatus |
| 英文摘要 | A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top. |
| 公开日期 | 2019-03-19 |
| 申请日期 | 2016-09-14 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37912]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING |
| 推荐引用方式 GB/T 7714 | ISHIGE, YUTA,KATAYAMA, ETSUJI,MORI, HAJIME. Semiconductor laser module and three-dimensional laminating and shaping apparatus. US10234645. 2019-03-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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