Light emitting device package
文献类型：专利
| 作者 | RYU, CHUNG HEE; MIN, BONG KUL; SON, WON JIN; LEE, WON BONG |
| 发表日期 | 2019-05-01 |
| 专利号 | EP3223322B1 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Light emitting device package |
| 英文摘要 | A light emitting device package (100) includes a frame (110), a first lead frame (120) spaced apart from the frame by a specific distance, a second lead frame (130) spaced apart from the frame by the specific distance, a body (170) coupled to the frame and the first and second lead frames and having a first cavity (171a), and a plurality of light emitting devices (150) on the frame exposed through the first cavity. The body includes a reflective part (190) which is provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency. The deformation of the light emitting device package resulting from the contraction and the expansion of the light emitting device package is prevented by the reflective part. The deformation of a molding part resulting from the contraction and expansion of the molding part is prevented by the reflective part. |
| 公开日期 | 2019-05-01 |
| 申请日期 | 2017-03-22 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37979]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | RYU, CHUNG HEE,MIN, BONG KUL,SON, WON JIN,et al. Light emitting device package. EP3223322B1. 2019-05-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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