Strain-tolerant die attach with improved thermal conductivity, and method of fabrication
文献类型：专利
| 作者 | KARLICEK, JR., ROBERT F. |
| 发表日期 | 2019-09-10 |
| 专利号 | US10410958 |
| 著作权人 | SOLIDUV, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Strain-tolerant die attach with improved thermal conductivity, and method of fabrication |
| 英文摘要 | A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials. |
| 公开日期 | 2019-09-10 |
| 申请日期 | 2017-07-26 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38014]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SOLIDUV, INC. |
| 推荐引用方式 GB/T 7714 | KARLICEK, JR., ROBERT F.. Strain-tolerant die attach with improved thermal conductivity, and method of fabrication. US10410958. 2019-09-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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