Light emitting package having phosphor layer over a transparent resin layer
文献类型：专利
| 作者 | KIM, KI SEOK; KIM, WON JUNG; SONG, JUNE O; LIM, CHANG MAN |
| 发表日期 | 2019-05-21 |
| 专利号 | US10297725 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light emitting package having phosphor layer over a transparent resin layer |
| 英文摘要 | The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device. |
| 公开日期 | 2019-05-21 |
| 申请日期 | 2017-09-29 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38032]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, KI SEOK,KIM, WON JUNG,SONG, JUNE O,et al. Light emitting package having phosphor layer over a transparent resin layer. US10297725. 2019-05-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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