Mass transfer of micro structures using adhesives
文献类型：专利
| 作者 | CHONG, WING CHEUNG; ZHANG, LEI ; OU, FANG; LI, QIMING
|
| 发表日期 | 2019-06-18 |
| 专利号 | US10325893 |
| 著作权人 | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Mass transfer of micro structures using adhesives |
| 英文摘要 | Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an integrated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate substrate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive. |
| 公开日期 | 2019-06-18 |
| 申请日期 | 2017-12-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38047]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
| 推荐引用方式 GB/T 7714 | CHONG, WING CHEUNG,ZHANG, LEI,OU, FANG,et al. Mass transfer of micro structures using adhesives. US10325893. 2019-06-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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