Optical component packaging structure
文献类型：专利
| 作者 | CHANG, YI-CHANG; CHEN, YEN-HSIN; SHEN, CHI-CHIH |
| 发表日期 | 2019-10-08 |
| 专利号 | US10439077 |
| 著作权人 | PIXART IMAGING INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical component packaging structure |
| 英文摘要 | The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure. |
| 公开日期 | 2019-10-08 |
| 申请日期 | 2018-05-15 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38097]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PIXART IMAGING INC. |
| 推荐引用方式 GB/T 7714 | CHANG, YI-CHANG,CHEN, YEN-HSIN,SHEN, CHI-CHIH. Optical component packaging structure. US10439077. 2019-10-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。