Method and system for field assisted statistical assembly of wafers
文献类型：专利
| 作者 | FONSTAD, JR., CLIFTON G.; ZAHN, MARKUS |
| 发表日期 | 2004-11-30 |
| 专利号 | US6825049 |
| 著作权人 | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method and system for field assisted statistical assembly of wafers |
| 英文摘要 | A wafer having heterostructure therein is formed using a substrate with recesses formed within a dielectric layer. A magnetized magnetic layer or a polarized electret material is formed at the bottom of each recess. The magnetized magnetic layer or a polarized electret material provides a predetermined magnetic or electrical field pattern. A plurality of heterostructures is formed from on an epitaxial wafer wherein each heterostructure has formed thereon a non-magnetized magnetic layer that is attracted to the magnetized magnetic layer formed at the bottom of each recess or dielectric layer that is attracted to the polarized electret material formed at the bottom of each recess. The plurality of heterostructures is etched from the epitaxial wafer to form a plurality of heterostructure pills. The plurality of heterostructure pills is slurried over the surface of the dielectric layer so that individual heterostructure pills can fall into a recess and be retained therein due to the strong short-range magnetic or electrical attractive force between the magnetized magnetic layer in the recess and the non-magnetized magnetic layer on the heterostructure pill or between the polarized electret material in the recess and the dielectric on the heterostructure pill. Any excess heterostructure pills that are not retained in a recess formed within the dielectric layer are removed and an overcoat is applied to form a substantial planar surface. |
| 公开日期 | 2004-11-30 |
| 申请日期 | 2003-01-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38146]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| 推荐引用方式 GB/T 7714 | FONSTAD, JR., CLIFTON G.,ZAHN, MARKUS. Method and system for field assisted statistical assembly of wafers. US6825049. 2004-11-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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