Wafer dividing method
文献类型：专利
| 作者 | NAGAI, YUSUKE; NAKAMURA, MASARU |
| 发表日期 | 2008-03-25 |
| 专利号 | US7348199 |
| 著作权人 | DISCO CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Wafer dividing method |
| 英文摘要 | A wafer processing method of dividing a wafer having function elements formed in areas sectioned by dividing lines formed on the front surface in a lattice pattern, into individual chips along the dividing lines, which comprises a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer along the dividing lines; a wafer supporting step for putting the back surface of the wafer on an extensible support tape mounted on an annular frame; and a dividing step for dividing the wafer along the dividing lines by expanding the support tape affixed to the wafer, wherein the dividing step comprises first dividing the wafer along dividing lines extending in a predetermined direction and subsequently, along dividing lines extending in a direction intersecting with the predetermined direction by expanding the support tape such that tensile force acting in a direction perpendicular to the dividing lines extending in the predetermined direction becomes larger than tensile force acting in a direction perpendicular to the dividing lines extending in the direction intersecting with the predetermined direction, when the supporting tape affixed to the wafer is expanded. |
| 公开日期 | 2008-03-25 |
| 申请日期 | 2005-06-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38261]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DISCO CORPORATION |
| 推荐引用方式 GB/T 7714 | NAGAI, YUSUKE,NAKAMURA, MASARU. Wafer dividing method. US7348199. 2008-03-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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