Conductive adhesive agent with ultrafine particles
文献类型：专利
| 作者 | OSAKO, KATSUHISA; SHIOI, NAOTO; ITOH, DAISUKE; GOTOH, HIDEYUKI; MATSUBA, YORISHIGE; TATEYAMA, KAZUKI; UKITA, YASUNARI; SEGAWA, MASAO; KIKUCHI, TAKUO |
| 发表日期 | 2007-08-28 |
| 专利号 | US7262511 |
| 著作权人 | HARIMA CHEMICALS, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Conductive adhesive agent with ultrafine particles |
| 英文摘要 | The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved. |
| 公开日期 | 2007-08-28 |
| 申请日期 | 2005-08-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38265]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HARIMA CHEMICALS, INC. |
| 推荐引用方式 GB/T 7714 | OSAKO, KATSUHISA,SHIOI, NAOTO,ITOH, DAISUKE,et al. Conductive adhesive agent with ultrafine particles. US7262511. 2007-08-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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