Method of making light emitting device with silicon-containing encapsulant
文献类型：专利
| 作者 | BOARDMAN, LARRY D.; THOMPSON, D. SCOTT; LEATHERDALE, CATHERINE A.; OUDERKIRK, ANDREW J. |
| 发表日期 | 2008 |
| 专利号 | US7314770 |
| 著作权人 | 3M INNOVATIVE PROPERTIES COMPANY |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of making light emitting device with silicon-containing encapsulant |
| 英文摘要 | A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. |
| 公开日期 | 2008 |
| 申请日期 | 2005-10-17 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38278]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 3M INNOVATIVE PROPERTIES COMPANY |
| 推荐引用方式 GB/T 7714 | BOARDMAN, LARRY D.,THOMPSON, D. SCOTT,LEATHERDALE, CATHERINE A.,et al. Method of making light emitting device with silicon-containing encapsulant. US7314770. 2008-01-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。