Laser processing method for wafer
文献类型：专利
| 作者 | MORISHIGE, YUKIO; ASANO, KENJI; YAMASHITA, YOHEI |
| 发表日期 | 2010-05-11 |
| 专利号 | US7713845 |
| 著作权人 | DISCO CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser processing method for wafer |
| 英文摘要 | A laser processing method for a wafer such that a laser beam is applied to a work surface of the wafer along a separation line formed on the work surface to thereby form a laser processed groove along the separation line on the work surface by ablation. The laser processing method includes a protective material coating step for coating the work surface of the wafer with a liquid protective material mainly containing a water-soluble silicone oil and a laser processed groove forming step for applying the laser beam to the work surface coated with the protective material along the separation line in the condition that the protective material has fluidity, thereby forming the laser processed groove along the separation line. |
| 公开日期 | 2010-05-11 |
| 申请日期 | 2007-09-19 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38433]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DISCO CORPORATION |
| 推荐引用方式 GB/T 7714 | MORISHIGE, YUKIO,ASANO, KENJI,YAMASHITA, YOHEI. Laser processing method for wafer. US7713845. 2010-05-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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