Method for assembling array-type semiconductor laser device
文献类型：专利
| 作者 | NAKATSUKA, SHINICHI |
| 发表日期 | 2011-02-15 |
| 专利号 | US7888146 |
| 著作权人 | RICOH COMPANY, LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method for assembling array-type semiconductor laser device |
| 英文摘要 | According to an aspect of the present invention, there is provided a method for assembling a semiconductor laser device, including: preparing a laser chip including: a substrate; stripe waveguides that are formed on the substrate and that each includes a gain producing area and a window area; electrodes formed on the stripe waveguides; an insulating layer formed on the electrodes; a metal layer formed on the insulating layer; projections arranged at an interval in the window areas; and joining structures connected to the electrodes and formed in the window areas; preparing a submount including: a first solder; second solders arranged at the interval; and submount electrodes connected to the second solders; contacting the laser chip to the submount by fitting the projections with respect to the second solders; and heating the submount and the laser chip. |
| 公开日期 | 2011-02-15 |
| 申请日期 | 2008-07-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38469]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | RICOH COMPANY, LTD. |
| 推荐引用方式 GB/T 7714 | NAKATSUKA, SHINICHI. Method for assembling array-type semiconductor laser device. US7888146. 2011-02-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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