Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head
文献类型：专利
| 作者 | OGIHARA, MITSUHIKO |
| 发表日期 | 2010-10-12 |
| 专利号 | US7811841 |
| 著作权人 | OKI DATA CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head |
| 英文摘要 | A semiconductor composite apparatus includes a semiconductor thin film and a metal layer formed on a substrate. The semiconductor thin film is bonded to the metal layer formed on the substrate. A region is formed between the semiconductor thin film and the metal surface, and contains an oxide of a metal that forms the metal surface. The metal surface is a surface of a metal layer provided on the substrate. The metal surface contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au. The metal surface is coated with either a Pd layer or an Ni layer. |
| 公开日期 | 2010-10-12 |
| 申请日期 | 2008-08-29 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38475]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI DATA CORPORATION |
| 推荐引用方式 GB/T 7714 | OGIHARA, MITSUHIKO. Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head. US7811841. 2010-10-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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