Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
文献类型：专利
| 作者 | EDMOND, JOHN ADAM |
| 发表日期 | 2013-09-03 |
| 专利号 | US8524515 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die |
| 英文摘要 | A light emitting device includes a single semiconductor die light emitting diode and at least five bond pads on the single semiconductor die. The bond pads may be in the four corners and at least one midpoint of the single semiconductor die. A wavelength conversion layer may be provided and bond pad extensions may extend through the wavelength conversion layer. Multiple wire bond connections may also be provided. |
| 公开日期 | 2013-09-03 |
| 申请日期 | 2010-11-03 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38535]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | EDMOND, JOHN ADAM. Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die. US8524515. 2013-09-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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